MSP430F2350TRHAT

Product Summary

The MSP430F2350TRHAT is an ultra-low-power microcontroller. The MSP430F2350TRHAT consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The MSP430F2350TRHAT features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.

Parametrics

MSP430F2350TRHAT absolute maximum ratings: (1)Voltage applied at VCC to VSS: -0.3 V to 4.1 V; (2)Voltage applied to any pin: -0.3 V to (VCC + 0.3 V); (3)Diode current at any device terminal: ±2 mA; (4)Storage temperature, Tstg: -55 to 150℃.

Features

MSP430F2350TRHAT features: (1)Low Supply Voltage Range: 1.8 V to 3.6 V; (2)Ultra-Low Power Consumption: Active Mode: 270 μA at 1 MHz, 2.2 V; Standby Mode: 0.7 μA; Off Mode (RAM Retention): 0.1 μA; (3)Ultra-Fast Wake-Up From Standby Mode in Less Than 1 μs; (4)16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time; (5)Basic Clock Module Configurations: Internal Frequencies up to 16 MHz With Four Calibrated Frequencies to ±1%; Internal Very-Low-Power Low-Frequency (LF) Oscillator; 32-kHz Crystal; High-Frequency (HF) Crystal up to 16 MHz; Resonator; External Digital Clock Source; External Resistor; (6)16-Bit Timer_A With Three Capture/Compare Registers; (7)16-Bit Timer_B With Three Capture/Compare Registers; (8)On-Chip Comparator for Analog Signal Compare Function or Slope Analog-to-Digital (A/D) Conversion; (9)Universal Serial Communication Interface: Enhanced UART Supporting Auto Baudrate Detection (LIN); IrDA Encoder and Decoder; Synchronous SPI I2C; (10)Brownout Detector; (11)Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse; (12)Bootstrap Loader; (13)On-Chip Emulation Module; (14)Available in 40-Pin QFN Package and 49-Pin Die-Sized BGA Package.

Diagrams